Services

DALIC - Electrochemical Molecular Bond repairs

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PHONE
: 041970454
DESCRIPTION
 

Electrochemical Molecular Bond repairs. The process builds/repairs using Copper to fill the damage, then Nickel-Cobalt alloy for a hard face finish. Because of the MOLECULAR bonding process, adhesion is excellent, and the new surface offers protection against wear, corrosion, and is finished to exacting print industry tolerances. Deep pitting, or damage can be removed without pre-machining, retaining the integrity of the part, this is particularly effective on large cylinders as used in industries such as Printing, Paper making etc. Repairs or build-ups can also be carried out using new DOT WELDING techniques locally welds dots of metal into deep impact damage, saving time; this repair is also capped off with Nickel-Cobalt alloy, as a hard wearing surface. Work is carried out on-site and in-situ, reducing down time and strip down cost.


15 YEARS EXPERIENCE----EXTENSIVE CUSTOMER LIST WORLD RECOGNISED PROCESS WORK


CARRIED OUT ON-SITE AND IN-SITU ALL WORK GUARENTEED

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